相关设备厂商直呼：“每天都在加班，订单爆了！”——据台湾经济日报，台积电将在嘉义科学园区先进封装厂新厂加大投资，总投资额超过 5000 亿元新台币，约合人民币 1137 亿元，主要扩充晶圆基片芯片（CoWoS）先进封装产能。随着人工智能（AI）的蓬勃发展，全球对先进半导体封装的需求激增。大力扩产的同时，台积电还计划将 CoWoS 先进封装技术引入日本。
Equipment manufacturers are exclaiming, “Working overtime every day, orders are exploding!” According to Taiwan Economic Daily, Taiwan Semiconductor Manufacturing Company (TSMC) will increase its investment in the new advanced packaging plant at the Chiayi Science Park, with a total investment of over 500 billion New Taiwan dollars, equivalent to approximately 113.7 billion Chinese yuan. The investment aims to primarily expand the capacity for Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging. With the thriving development of artificial intelligence (AI), global demand for advanced semiconductor packaging has surged. In addition to ramping up production, TSMC also plans to introduce CoWoS advanced packaging technology to Japan.
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